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总结
多家科技媒体报道，研究人员在《自然》发表成果：通过电注入方式实现一种固态表面声波“声子激光器”，可在微小芯片表面产生类似“微型地震”的振动波。该类高频、可控的表面声波有望用于新一代无线通信相关器件，从而减少手机内部射频等模块体积，帮助未来智能手机做得更薄、传输更快并提升能效与集成度。不过报道也强调这仍属早期研究，距离大规模商用与产业验证尚有距离。
正文
An earthquake on a chip: New tech could make smartphones smaller, faster Tech Xplore An electrically injected solid-state surface acoustic wave phonon laser Nature "The Waves From an Earthquake, Only On the Surface of a Small Chip": This Vibrating Laser May Be the Future of Wireless Technology The Debrief This chip can make future phones thinner and faster through tiny 'earthquakes' Digital Trends 'Tiniest earthquakes' could shrink and speed up future smartphones Interesting Engineering
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