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总结
印度政府在电子元器件制造激励计划（ECMS/PLI）下批准第三批共22项申请，涉及投资规模约4.1863万亿卢比（41,863 crore），项目分布在8个邦。官方称此举旨在扩大本土电子元器件与半导体相关供应链能力、吸引企业加大制造投入，并为未来整机与出口提供配套支撑。报道同时提到部分印度半导体项目预计自2026年起进入商业化生产阶段。
正文
Electronics component scheme scales up with Rs 41,863-crore approvals; projects spread across 8 states Moneycontrol Government okays 22 proposals under electronics components manufacturing scheme The Hindu Third tranche of ECMS approved with Rs 41,863 crore investment covering 22 applications ANI News 4 Indian semiconductor units to begin commercial production from 2026: Vaishnaw The New Indian Express India approves 22 projects under Electronics Component PLI scheme CNBC TV18
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