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总结
中国人工智能芯片设计公司壁仞科技（Biren）在香港完成约7.17亿美元首次公开募股后于港交所挂牌交易，首日股价盘中较发行价上涨逾100%，成为近期港股新股市场的亮点。多家媒体称，AI芯片与算力相关投资热度升温、资金回流科技板块，推动更多中国半导体与AI公司选择赴港融资并形成新一轮IPO浪潮。该股强势表现被视为对香港新股市场情绪与后续上市项目定价的风向标。
正文
China AI chipmaker Biren soars over 100% on Hong Kong debut as IPO wave builds Yahoo Finance AI Chip Designer Biren to Debut After $717 Million Hong Kong IPO Bloomberg.com Chinese AI chipmaker Biren soars on trading debut Nikkei Asia Chinese tech stocks charged into 2026 with an AI chip IPO surge and more listings lined up Business Insider Shares in Chinese GPU start-up Biren soar in Hong Kong listing South China Morning Post
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