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总结
印度中央政府近日批准电子元器件制造激励（PLI/ECMS）计划第三批共22个项目申请，官方披露预计将带动约4,186亿卢比（41,863 crore）投资，覆盖关键电子零部件、材料与半导体配套环节。信息技术部长瓦伊什瑙表示，政策将以与产出挂钩的激励吸引企业在印度扩产，完善电子制造供应链、降低进口依赖并提升本土增值；同时称至少4个印度半导体项目预计自2026年前后开始商业化生产。
正文
Centre clears 22 projects under electronics components PLI scheme; Rs 41,863 crore investment expected The Economic Times Government okays 22 proposals under electronics components manufacturing scheme The Hindu Third tranche of ECMS approved with Rs 41,863 crore investment covering 22 applications ANI News 4 Indian semiconductor units to begin commercial production from 2026: Vaishnaw The New Indian Express India approves 22 projects under Electronics Component PLI scheme CNBC TV18
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