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总结
印度中央政府近日在电子元器件生产挂钩激励（PLI）计划下批准22个项目申请，预计将带动约4.1863万亿卢比投资。该批项目覆盖关键电子零部件与相关制造环节，旨在提升本土供应链配套能力、扩大产能并降低对进口依赖，同时通过政策补贴吸引企业加码投入，推动印度电子制造业与半导体等领域的产业升级与就业增长。
正文
Centre clears 22 projects under electronics components PLI scheme; Rs 41,863 crore investment expected The Economic Times Government okays 22 proposals under electronics components manufacturing scheme The Hindu Third tranche of ECMS approved with Rs 41,863 crore investment covering 22 applications ANI News 4 Indian semiconductor units to begin commercial production from 2026: Vaishnaw The New Indian Express India approves 22 projects under Electronics Component PLI scheme CNBC TV18
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