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总结
在CES 2026前后，AMD发布面向2026年笔记本与桌面/迷你PC的Ryzen AI与X3D相关新品与平台更新。报道指出这些产品在架构与定位上更像对上一代方案的“再加热/重包装”，重点强化本地AI能力与能效，推出Ryzen AI 400与Ryzen AI Halo等平台，配置Zen 5 CPU与RDNA 3.5核显，并宣称NPU最高可达约60 TOPS。AMD希望借此推动“AI无处不在”的PC生态，并在移动端与小型工作站场景对标英特尔与英伟达等竞争对手。
正文
AMD reheats last year's Ryzen AI and X3D CPUs for 2026's laptops and desktops Ars Technica AMD and its Partners Share their Vision for "AI Everywhere, for Everyone" at CES 2026 Yahoo Finance Australia AMD announces Ryzen AI Halo mini-PC platform aimed at local AI, positioned against NVIDIA DGX Spark VideoCardz.com AMD's New Ryzen AI 400 CPUs Will Put More AI Muscle Into Laptops, Mini Desktops PCMag Australia AMD launches Ryzen AI 400: 12 Zen5 cores with up to 3.1 GHz RDNA3.5 and 60 TOPS NPU VideoCardz.com
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